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INTEGRATED CIRCUITS
DATA SHEET
TDA2611A 5 W audio power amplifier
Product specification File under Integrated Circuits, IC01 November 1982
Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
The TDA2611A is a monolithic integrated circuit in a 9-lead single in-line (SIL) plastic package with a high supply voltage audio amplifier. Special features are: * possibility for increasing the input impedance * single in-line (SIL) construction for easy mounting * very suitable for application in mains-fed apparatus * extremely low number of external components * thermal protection * well defined open loop gain circuitry with simple quiescent current setting and fixed integrated closed loop gain. QUICK REFERENCE DATA Supply voltage range Repetitive peak output current Output power at dtot = 10% VP = 18 V; RL = 8 VP = 25 V; RL = 15 Total harmonic distortion at Po < 2 W; RL = 8 Input impedance Total quiescent current at VP = 18 V Sensitivity for Po = 2,5 W; RL = 8 Operating ambient temperature Storage temperature Po Po dtot |Zi| Itot Vi Tamb Tstg typ. typ. typ. typ. typ. typ. 4,5 W 5W 0,3 % 45 k 25 mA 55 mV VP IORM < 6 to 35 V 1,5 A
-25 to + 150 C -55 to + 150 C
PACKAGE OUTLINE 9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 23.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.1 Circuit diagram; pin 3 not connected.
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage Non-repetitive peak output current Repetitive peak output current Total power dissipation Storage temperature Operating ambient temperature VP IOSM IORM Tstg Tamb max. max. max. 35 V 3A 1,5 A
see derating curves Fig. 2 -55 to + 150 C -25 to + 150 C
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.2 Power derating curves.
HEATSINK EXAMPLE Assume VP = 18 V; RL = 8 ; Tamb = 60 C maximum; Tj = 150 C (max. for a 4 W application into an 8 load, the maximum dissipation is about 2,2 W). The thermal resistance from junction to ambient can be expressed as: 150 - 60 R th j-a = R th j-tab + R th tab-h + R th h-a = --------------------- = 41 K/W. 2, 2 Since Rth j-tab = 11 K/W and Rth tab-h = 1 K/W, Rth h-a = 41 - (11 + 1) = 29 K/W.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
D.C. CHARACTERISTICS Supply voltage range Repetitive peak output current Total quiescent current at VP = 18 V VP IORM Itot
TDA2611A
6 to 35 V < typ. 1,5 A 25 mA
A.C. CHARACTERISTICS Tamb = 25 C; VP = 18 V; RL = 8 ; f = 1 kHz unless otherwise specified; see also Fig. 3 A.F. output power at dtot = 10% VP = 18 V; RL = 8 VP = 12 V; RL = 8 VP = 8,3 V; RL = 8 VP = 20 V; RL = 8 VP = 25 V; RL = 15 Total harmonic distortion at Po = 2 W Frequency response Input impedance Noise output voltage at RS = 5 k; B = 60 Hz to 15 kHz Sensitivity for Po = 2,5 W Note 1. Input impedance can be increased by applying C and R between pins 5 and 9 (see also Figures 6 and 7). |Zi| Vn Vi Po Po Po Po Po dtot > typ. typ. typ. typ. typ. typ. < > typ. typ. < typ. 4W 4,5 W 1,7 W 0,65 W 6W 5W 0,3 % 1% 15 kHz 45 k(1) 0,2 mV 0,5 mV 55 mV 44 to 66 mV
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.3 Test circuit; pin 3 not connected.
Fig.4 Total harmonic distortion as a function of output power.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.5 Output power as a function of supply voltage.
Fig.6
Input impedance as a function of frequency; curve a for C = 1 F, R = 0 ; curve b for C = 1 F, R = 1 k; circuit of Fig. 3; C2 = 10 pF; typical values.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.7 Input impedance as a function of R in circuit of Fig. 3; C = 1 F; f = 1 kHz.
Fig.8 Total harmonic distortion as a function of RS in the circuit of Fig. 3; Po = 3,5 W; f = 1 kHz.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.9 Total power dissipation and efficiency as a function of output power.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
APPLICATION INFORMATION
TDA2611A
Fig.10 Ceramic pickup amplifier circuit.
Fig.11 Total harmonic distortion as a function of output power; with tone control; - - - without tone control; in circuit of Fig. 10; typical values.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
TDA2611A
Fig.12 Frequency characteristics of the circuit of Fig. 10; tone control max. high; - - - tone control min. high; Po relative to 0 dB = 3 W; typical values.
Fig.13 Frequency characteristic of the circuit of Fig. 10; volume control at the top; tone control max. high.
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads
TDA2611A
SOT110-1
D
D1 q P P1 A2
A3 q1 q2
A A4 seating plane E pin 1 index
L 1 Z b2 e b b1 wM 9 Q
c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-25
November 1982
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Philips Semiconductors
Product specification
5 W audio power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA2611A
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
November 1982
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